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HPW-0101JY




 

Specifications  
Wafer Size 8inch (Notch)
Wafer Thickness 725±25μm
Chip Size 3.0mm ♦
Pad Pitch 300μm
Function Thermal Analysis by Diode
Heat Generation by Resistance
Electrode Al pad
Cu Pillar Bump
Solder Bump
Au Bump
Pad Size 120μm ♦
Passivation Opening 70μm (Octagon)
Polyimide Opening φ90μm
Scribe Line Width 80μm
Number of Pad 32pads
Maximum Output Max. 14.5W/Chip
<Option> Back Side Metallization
  ♦ Bottom Side