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STAC-0101JY




 

Specifications  
Wafer Size 6inch(OrientationFlat)
Wafer Thickness 550±25μm
Chip Size 3.0mm ♦
Pad Pitch 300μm
Function Stress Analysis by Piezoresistance
Thermal Analysis by Diode
Heat Generation by Resistance
Electrode Al pad
Cu Pillar Bump
Solder Bump
Au Bump
Pad Size 120μm ♦
Passivation Opening 70μm (Octagon)
Polyimide Opening φ90μm
Scribe Line Width 80μm
Number of Pad 32pads
<Option> Back Side Metallization
  ♦ Bottom Side





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