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KIT FC120




Practical Components-KIT FC120

  

Wafer Size 8inch
Wafer Thickness 725±25μm
Chip Size 10mm
Bump Pitch 120μm
Pad Config Area
Electrode Cu Pillar
Pad Size 80μm
Passivation Opening φ20μm
Ployimide Opening φ40μm
UBM Size φ65μm
Bumb Size φ60μm
Scribe Width 100μm
Number of Pad 5776 pads/chip (76x76)
Number of Chip 208 chips/wafer