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WLP TEG (Free Size Cut TEG: TEG0306, TEG0408, TEG0510)




 

Free Size Cut TEG   TEG0306 TEG0408 TEG0510
Wafer Size   8 inch 8 inch 8 inch
Wafer Thickness   400μm(or more) 400μm(or more) 400μm(or more)
Cut Size
(Scribe Line Included)
Min 600μm×600μm 800μm×800μm 1000μm×1000μm
Pad Pitch   300μm 400μm 500μm
Function   Daisy Chain Daisy Chain Daisy Chain
Electrode   Ball Mounted Solder Bump Ball Mounted Solder Bump Ball Mounted Solder Bump
Post Size   175μm 200μm 250μm
Number of Chip   79,257 chips/wafer 44,161 chips/wafer 28,212 chips/wafer