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Specifications | TYPE-A | TYPE-B |
Wafer Size | 8 inch | 8 inch |
Wafer Thickness | 725±25μm | 725±25μm |
Chip Size | 10.0mm | 10.0mm |
Pad Surface | Cu | Cu |
Pad Pitch | 200μm | - |
Pad Size | 160um | 160um |
Evaluation Pattern |
>Comb-Pattern |
>Comb-Pattern >Single-Line |
Number of Pad |
96pads |
36pads |